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Integrated circuits -- Congresses

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• Integrated circuits
• Electronic circuits -- Congresses
• Microelectronics -- Congresses
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• Integrated circuits -- Testing -- Congresses

• Semiconductor electronics and integrated circuits. (College of Engineering, University of Michigan, between 1000 and 1999), by University of Michigan. Engineering Summer Conferences (page images at HathiTrust; US access only)
• ARPA/NBS workshop I: measurement problems in integrated circuit processing and assembly (U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.], 1974), by Harry A. Schafft (page images at HathiTrust)

• ARPA/NBS workshop III : test patterns for integrated circuits (U.S. Dept. of Commerce, National Bureau of Standards :, 1976), by Harry A. Schafft (page images at HathiTrust)
• Semiconductor measurement technology. (U.S. Dept. of Commerce, National Bureau of Standards :, 1974), by Harry A. Schafft (page images at HathiTrust)
• ARPA/NBS workshop II : hermeticity testing for integrated circuits (National Bureau of Standards, U.S. Dept. of Commerce, 1974), by Harry A. Schafft and United States. Advanced Research Projects Agency (page images at HathiTrust; US access only)

Items below (if any) are from related and broader terms.

• Transistor engineering and introduction to integrated semiconductor circuits (McGraw-Hill, 1962), by Alvin B. Phillips (page images at HathiTrust)
• Angular sensitivity of controlled implanted doping profiles (U.S. Dept. of Commerce, National Bureau of Standards :, 1978), by Robert G. Wilson (page images at HathiTrust)
• In the matter of certain plastic encapsulated integrated circuits : investigation no. 337-TA-315 (U.S. International Trade Commission, 1992), by United States International Trade Commission (page images at HathiTrust)
• Line certification requirements for microcircuits. ([Washington], 1971), by United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance (page images at HathiTrust)
• Erasable programmable read only memories from Japan : determination of the Commission in investigation no. 731-TA-288 (preliminary) under the Tariff Act of 1930, together with the information obtained in the investigation. (U.S. International Trade Commission, 1985), by United States International Trade Commission (page images at HathiTrust)
• Universal test fixture for monolithic mm-wave integrated circuits calibrated with an augmented TRD algorithm (National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Division ;, 1989), by Robert R. Romanofsky, Kurt A. Shalkhauser, and United States. National Aeronautics and Space Administration. Office of Management (page images at HathiTrust)
• Erasable programmable read only memories from Japan : determination of the Commission in investigation no. 731-TA-288 (final) under the Tariff act of 1930, together with the information obtained in the investigation. (U.S. International Trade Commission, 1986), by United States International Trade Commission, Howard Gooley, Judith C. Zeck, and Nelson Hogge (page images at HathiTrust)
• Imports under items 806.30 and 807.00 of the Tariff schedules of the United States, 1982-85 : report on investigation no. 332-237, under section 332(b) of the Tariff Act of 1930. (U.S. International Trade Commission, 1986), by United States International Trade Commission (page images at HathiTrust)
• Optically isolated logarithmic nanoammeter capable of floating to 5 kilovolts (National Aeronautics and Space Administration, Scientific and Technical Information Branch ;, 1979), by John C. Sturman, John C. DeLaat, United States. National Aeronautics and Space Administration. Scientific and Technical Information Branch, and Lewis Research Center (page images at HathiTrust)
• Study of failure modes of multilevel large scale integrated circuits (National Aeronautics and Space Administration ;, 1970), by Earl S. Schlegel, Electronics Research Center (U.S.), and Philco-Ford Corporation (page images at HathiTrust)
• High and low threshold P-channel metal oxide semiconductor process and description of microelectronics facility (U.S. National Aeronautics and Space Administration ;, 1976), by David L. Bouldin, United States National Aeronautics and Space Administration, and George C. Marshall Space Flight Center (page images at HathiTrust)
• A complementary MOS process (National Aeronautics and Space Administration ;, 1977), by Murzban D. Jhabvala (page images at HathiTrust)
• An integrated circuit floating point accumulator (National Aeronautics and Space Administration ;, 1977), by Theodore C. Goldsmith and United States National Aeronautics and Space Administration (page images at HathiTrust)
• NASA TN D-5866 (National Aeronautics and Space Administration :, 1970), by Rosemary P. Beatty, Electronics Research Center, and United States National Aeronautics and Space Administration (page images at HathiTrust)
• NASA TN D-4584 (National Aeronautics and Space Administration ;, 1968), by Guss E. Wenzel, Manned Spacecraft Center (U.S.), and United States National Aeronautics and Space Administration (page images at HathiTrust)
• Application of integrated circuits to telemetry systems (National Aeronautics and Space Administration :, 1964), by John Michael Balderston and Goddard Space Flight Center (page images at HathiTrust)
• Safety of vital control and communication systems in guided ground transportation : analysis of railroad signaling system : microprocessor interlocking. (U.S. Department of Transportation, Federal Railroad Administration, Office of Research and Development ;, 1993), by Thomas Bessoir, Simon Reich, United States. Federal Railroad Administration. Office of Research and Development, Foster-Miller, and inc Thomas K. Dyer (page images at HathiTrust)
• Computer program for designing optimal networks with MOS gates (Dept. of Computer Science, University of Illinois at Urbana-Champaign, 1972), by Teruaki Shinozaki (page images at HathiTrust)
• Electronic components, subsystems, and equipment : a compilation (NASA ;, 1975), by United States National Aeronautics and Space Administration (page images at HathiTrust)
• High-speed sequential gate control circuitry (Sandia Corporation ;, 1960), by Leonard Ehrman and Sandia Corporation (page images at HathiTrust)
• Latchup in dielectrically isolated integrated circuits (Research Triangle Park, North Carolina : Research Triangle Institute, 1969., 1969), by Mayrant Simons, R. P. Donovan, and United States. Defense Atomic Support Agency (page images at HathiTrust)
• BLS-3 balloon locating system (Hanscom AFB, Massachusetts : Air Force Geophysics Laboratory, Air Force Systems Command, United States Air Force, 1977., 1977), by Hans Laping, Alan R. Griffin, and U.S. Air Force Geophysics Laboratory (page images at HathiTrust)
• BCS-18A command decoder-selector (Hanscom AFB, Massachusetts : Air Force Geophysics Laboratory, Air Force Systems Command, United States Air Force, 1980., 1980), by Hans Laping and U.S. Air Force Geophysics Laboratory (page images at HathiTrust)
• Basic EMC technology advancement for C3 systems. (Rome Air Development Center, 1982), by Robert T. Abraham, Clayton R. Paul, Marty B. Jolly, Southeastern Center for Electrical Engineering Education, and Rome Air Development Center (page images at HathiTrust)
• Design, test and certification issues for complex integrated circuits (Federal Aviation Administration, Office of Aviation Research ;, 1996), by L. Harrison, B. Landell, Galaxy Scientific Corporation, and United States. Federal Aviation Administration. Office of Aviation Research (page images at HathiTrust)
• Digital systems validation handbook. Volume III, Design, test, and certification issues for complex integrated circuits : chapter 2 (Federal Aviation Administration Technical Center ;, 1996), by L. Harrison, B. Landell, Galaxy Scientific Corporation, and United States. Federal Aviation Administration. Office of Aviation Research (page images at HathiTrust)
• Energy source requirements for reliable circuitry (L.G. Hansom Field, Bedford, Massachusetts : Air Force Cambridge Research Laboratories, Office of Aerospace Research, United States Air Force, 1965., 1965), by Walton B. Bishop and Air Force Cambridge Research Laboratories (U.S.) (page images at HathiTrust)
• The Design of a more complex building block for digital systems (L. G. Hansom Field, Bedford, Massachusetts : Air Force Cambridge Research Laboratories, Office of Aerospace Research, United States Air Force, 1967., 1967), by W. Frank. King, Alfred Giusti, and Air Force Cambridge Research Laboratories (U.S.) (page images at HathiTrust)
• The 120-cell punched-card modifiable logic array (L.G. Hansom Field, Bedford, Massachusetts : Air Force Cambridge Research Laboratories, Office of Aerospace Research, United States Air Force, 1971., 1971), by Marvin E. Brooking, Alfred Giusti, and Air Force Cambridge Research Laboratories (U.S.) (page images at HathiTrust)

• Cracking DES: Secrets of Encryption Research, Wiretap Politics and Chip Design (1998), by Electronic Frontier Foundation (HTML at cryptome.org and other sites)
• Development of a monolithic ferrite memory array (National Aeronautics and Space Administration ;, 1972), by C. H. Heckler, N. C. Bhiwandker, Langley Research Center, and Ampex Corporation (page images at HathiTrust)
• NASA TN D-4091 (National Aeronautics and Space Administration ;, 1967), by Guss E. Wenzel, Manned Spacecraft Center (U.S.), and United States National Aeronautics and Space Administration (page images at HathiTrust)

• Procedures for precap visual inspection (NASA :, 1984), by United States. National Aeronautics and Space Administration. Scientific and Technical Information Branch (page images at HathiTrust)

• Semiconductor measurement technology. (U.S. Dept. of Commerce, National Bureau of Standards :, 1980), by W. E. Ham and United States Defense Advanced Research Projects Agency (page images at HathiTrust)

• Optical and dimensional-measurement problems with photomasking in microelectronics (U.S. Dept. of Commerce, National Bureau of Standards :, 1975), by John M. Jerke (page images at HathiTrust)

• Semiconductor measurement technology. (U.S. Dept. of Commerce, National Bureau of Standards :, 1980), by W. Murray Bullis (page images at HathiTrust)
• Characterization of a high frequency probe assembly for integrated circuit measurement (U.S. Dept. of Commerce, National Bureau of Standards :, 1975), by R. L. Jesch (page images at HathiTrust)

• Semiconductor measurement technology : techniques for measuring the integrity of passivation overcoats on integrated circuits (Dept. of Commerce, National Bureau of Standards : for sale by the Supt. of Docs., U.S. Govt. Print. Off., 1977), by Werner Kern, Robert B. Comizzoli, Radio Corporation of America. Laboratories Division, United States Defense Advanced Research Projects Agency, and United States. National Bureau of Standards (page images at HathiTrust)
• Semiconductor measurement technology : techniques for measuring the integrity of passivation overcoats on integrated circuits (Dept. of Commerce, National Bureau of Standards : for sale by the Supt. of Docs., U. S. Govt. Print. Off., 1977), by Werner Kern, Robert B. Comizzoli, Radio Corporation of America. Laboratories Division, United States Defense Advanced Research Projects Agency, and United States. National Bureau of Standards (page images at HathiTrust; US access only)

• Active and Passive Electronic Components (1985-) (partial serial archives)
• IEEE Open Journal of the Solid-State Circuits Society (2021-) (partial serial archives)
• Frontiers in Electronics (2020-) (partial serial archives)

• Microcircuit Device Reliability : Digital SSI/MSI data (Reliability Analysis Center, 1984), by Thomas A. Ballou and Reliability Analysis Center (page images at HathiTrust)

• Semiconductor measurement technology. (U.S. Dept. of Commerce, National Bureau of Standards :, 1981), by G. P. Carver, W. A. Cullins, and Center for Electronics and Electrical Engineering (U.S.). Electron Devices Division (page images at HathiTrust)
• Semiconductor measurement technology. (U.S. Dept. of Commerce, National Bureau of Standards :, 1981), by Michael A. Mitchell, Loren W. Linholm, Center for Electronics and Electrical Engineering (U.S.), and Air Force Wright Aeronautical Laboratories (page images at HathiTrust)
• Semiconductor measurement technology. (U.S. Dept. of Commerce, National Bureau of Standards :, 1980), by W. Murray Bullis (page images at HathiTrust)
• Semiconductor measurement technology. (U.S. Dept. of Commerce, National Bureau of Standards :, 1980), by W. E. Ham and United States Defense Advanced Research Projects Agency (page images at HathiTrust)
• Semiconductor measurement technology. (National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.], 1974), by Martin G. Buehler, United States. Defense Nuclear Agency, and United States Defense Advanced Research Projects Agency (page images at HathiTrust)
• Methods for testing wire-bond electrical connections (U.S. National Bureau of Standards :, 1973), by Harry A. Schafft (page images at HathiTrust)

More items available under broader and related terms at left.